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VOS200-HMDS

High Vacuum Drying Oven

 

For HMDS / Semiconductor Electronics

LAB1ST VOS200-HMDS is a specialized vacuum drying oven designed for HMDS (Hexamethyldisilazane) pretreatment in semiconductor wafer processing.

 

It automates key steps such as vacuum pumping, nitrogen purging, and vacuum holding, ensuring precise and repeatable HMDS coating processes for photolithography applications.

Features

  • Semiconductor-Specific HMDS Process Automation with vacuum capability up to 100 Pa

  • Programmable Control System for precise management of heating, vacuum, nitrogen purge, and timing parameters

  • 316 Stainless Steel Chamber offering superior corrosion resistance and durability

  • Chamber Heating System with no internal electronic components, ensuring contamination-free operation

  • Double-Layer Tempered Glass Door for clear visibility of the workspace

  • Adjustable Silicone Rubber Seal ensuring high vacuum integrity

  • Standard Over-Temperature Protection for enhanced operational safety

  • Standard Digital Vacuum Display for precise real-time monitoring

  • Low-Noise Professional Vacuum Pump  delivering stable and reliable vacuum control

  • RS485 Communication Interface  for remote monitoring and control

Specifications

Model
VOS200-60L-HV
VOS200-90L-HV
Environment Temp.
5 °C ~ 40 °C
Display Resolution
0.1°C
Temp. Fluctuation
±1 °C
Ultimate Vacuum
1.0×10⁻4 Pa
Vacuum Display
Electronic type
Chamber Material
316 Stainless Steel
Chamber Volume
64 L | 2.26 cu ft
91 L | 3.21 cu ft
Shelves
2 pcs
2 pcs
Heating Method
Chamber Heating
Chamber Heating
Inner Dimensions (WxDxH, mm)
400×400×400
450×450×450
Outer Dimensions (WxDxH, mm)
600×570×1390
610×590×1350
Power Input
3000 W
3500 W
Power Supply
AC220V 50Hz
AC220V 50Hz
Temp. Range
RT+10 °C ~ 200 °C
Anchor 1

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